I
- CY8C20142-SX1IT
- 制造商:Infineon Technologies
- 描述: IC CAPSENSE EXP 4 I/O 8-SOIC
- 规格书: CY8C20142-SX1IT.pdf
- RFQ
- CY8C20160-LDX2IT
- 制造商:Infineon Technologies
- 描述: IC CAPSENSE EXP 6 I/O 16QFN
- 规格书: CY8C20160-LDX2IT.pdf
- RFQ
- CY8C20160-SX2IT
- 制造商:Infineon Technologies
- 描述: IC CAPSENSE EXP 6 I/O 16SOIC
- 规格书: CY8C20160-SX2IT.pdf
- RFQ
- CY8C20180-SX2IT
- 制造商:Infineon Technologies
- 描述: IC CAPSENSE EXP 8 I/O 16SOIC
- 规格书: CY8C20180-SX2IT.pdf
- RFQ
- CY8C201A0-LDX2IT
- 制造商:Infineon Technologies
- 描述: IC CAPSENSE EXP 10 I/O 16QFN
- 规格书: CY8C201A0-LDX2IT.pdf
- RFQ
- CY8C201A0-SX2IT
- 制造商:Infineon Technologies
- 描述: IC CAPSENSE EXP 10 I/O 16SOIC
- 规格书: CY8C201A0-SX2IT.pdf
- RFQ
- CY8C20111-SX1I
- 制造商:Infineon Technologies
- 描述: IC CAPSENSE EXP 8-SOIC
- 规格书:
- RFQ
- CY8C20111-SX1IT
- 制造商:Infineon Technologies
- 描述: IC CAPSENSE EXP 8-SOIC
- 规格书:
- RFQ
- CY8C20121-SX1IT
- 制造商:Infineon Technologies
- 描述: IC CAPSENSE EXP 8-SOIC
- 规格书: CY8C20121-SX1IT.pdf
- RFQ
- TLE6212XUMA1
- 制造商:Infineon Technologies
- 描述: IC SENSOR FOR ABS/TC/ESC 64LQFP
- 规格书: TLE6212XUMA1.pdf
- RFQ
- TCA505BGGEGXUMA1
- 制造商:Infineon Technologies
- 描述: IC SWITCH PROXIMITY INDCT 16DSO
- 规格书: TCA505BGGEGXUMA1.pdf
- RFQ
- TCA505BGXLLA1
- 制造商:Infineon Technologies
- 描述: PROXIMITY SENSORS
- 规格书: TCA505BGXLLA1.pdf
- RFQ
- TCA505BG2XUMA1
- 制造商:Infineon Technologies
- 描述: INDUSTRIAL/ACCESSORY IC PG-DSO-1
- 规格书:
- RFQ
- U2720-XS1421C
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书:
- RFQ
- U2720-XS1421CB
- 制造商:IDT, Integrated Device Technology Inc
- 描述: WAFER (UNSAWN) - BOX
- 规格书:
- RFQ
- ZOPT1200AC4C
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书:
- RFQ
- ZOPT1200AC4CT
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书:
- RFQ
- ZSC31010CEC
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSC31010CEC.pdf
- RFQ
- ZSC31010CIC
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSC31010CIC.pdf
- RFQ
- ZSC31014EAC
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSC31014EAC.pdf
- RFQ
- ZSC31014EIC
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSC31014EIC.pdf
- RFQ
- ZSC31015EAC
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSC31015EAC.pdf
- RFQ
- ZSC31015EEC
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSC31015EEC.pdf
- RFQ
- ZSC31015EIC
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSC31015EIC.pdf
- RFQ
- ZSC31050FAC
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSC31050FAC.pdf
- RFQ
- ZSC31050FEC
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSC31050FEC.pdf
- RFQ
- ZSC31050FIC
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSC31050FIC.pdf
- RFQ
- ZSC31150GAC
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSC31150GAC.pdf
- RFQ
- ZSC31150GEC
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSC31150GEC.pdf
- RFQ
- ZSSC3015NA1B
- 制造商:IDT, Integrated Device Technology Inc
- 描述: WAFER (UNSAWN) - BOX
- 规格书:
- RFQ
- ZSSC3015NA1C
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书:
- RFQ
- ZSSC3015NE1B
- 制造商:IDT, Integrated Device Technology Inc
- 描述: WAFER (UNSAWN) - BOX
- 规格书: ZSSC3015NE1B.pdf
- RFQ
- ZSSC3015NE1C
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSSC3015NE1C.pdf
- RFQ
- ZSSC3015NE1D
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - WAFFLE PACK
- 规格书:
- RFQ
- ZSSC3016CC1B
- 制造商:IDT, Integrated Device Technology Inc
- 描述: WAFER (UNSAWN) - BOX
- 规格书: ZSSC3016CC1B.pdf
- RFQ
- ZSSC3016CC1C
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSSC3016CC1C.pdf
- RFQ
- ZSSC3016CC6B
- 制造商:IDT, Integrated Device Technology Inc
- 描述: WAFER (UNSAWN) - BOX
- 规格书: ZSSC3016CC6B.pdf
- RFQ
- ZSSC3016CI1B
- 制造商:IDT, Integrated Device Technology Inc
- 描述: WAFER (UNSAWN) - BOX
- 规格书: ZSSC3016CI1B.pdf
- RFQ
- ZSSC3016CI1BP
- 制造商:IDT, Integrated Device Technology Inc
- 描述: WAFER (UNSAWN) - BOX
- 规格书: ZSSC3016CI1BP.pdf
- RFQ
- ZSSC3016CI1C
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSSC3016CI1C.pdf
- RFQ
- ZSSC3016CI6B
- 制造商:IDT, Integrated Device Technology Inc
- 描述: WAFER (UNSAWN) - BOX
- 规格书: ZSSC3016CI6B.pdf
- RFQ
- ZSSC3016DI1B
- 制造商:IDT, Integrated Device Technology Inc
- 描述: WAFER (UNSAWN) - BOX
- 规格书: ZSSC3016DI1B.pdf
- RFQ
- ZSSC3016DI6B
- 制造商:IDT, Integrated Device Technology Inc
- 描述: WAFER (UNSAWN) - BOX
- 规格书: ZSSC3016DI6B.pdf
- RFQ
- ZSSC3018BA2C
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSSC3018BA2C.pdf
- RFQ
- ZSSC3018BA2D ES
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - WAFFLE PACK
- 规格书: ZSSC3018BA2D ES.pdf
- RFQ
- ZSSC3026CC1C
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSSC3026CC1C.pdf
- RFQ
- ZSSC3026CC6C
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSSC3026CC6C.pdf
- RFQ
- ZSSC3026CI1C
- 制造商:IDT, Integrated Device Technology Inc
- 描述: DICE (WAFER SAWN) - FRAME
- 规格书: ZSSC3026CI1C.pdf
- RFQ
- 13266709901
- 4000-969-680
-
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